Tuesday, June 19, 2012

Last payper



Last payper.


Last payper.


Last payper.


Wire bonding, packages, heat flux, power, reliability, ceramic, flip chip, failure, delamination.

Ok setel. sume da bercampur. waaaa.


Wish me luck for this final paper for final exam for final semester.



Advanced Electronic Packaging.





mood: gabraa lagi. =.= 







p/s: almost finish my DEGREE. :)

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